Title :
The Radiation Enhanced Diffusion (RED) Diode realization of a large area p+p-n-n+ structure with high SOA
Author :
Vobecki, J. ; Záhlava, V. ; Hemmann, K. ; Arnold, M. ; Rahimo, M.
Author_Institution :
Semicond., ABB Switzerland Ltd., Lenzburg, Switzerland
Abstract :
In this paper, we introduce a fully functional high voltage (Vrrm = 4.5 kV) and high current (IFM= 7 kA) p+p-n-n+ diode based on radiation enhanced diffusion (RED) technology. The RED-Diode employs a low-doped p-layer buried at ap100 mum to increase the dynamic avalanche ruggedness for high SOA capability. The diode was processed on a 100 mm wafer and can safely turn off 4 and 7 kA @ 140degC @ 1500 A/mus for the diameters of 51 and 91 mm, resp. The RED of Pd was also extended from He to H irradiation. Compared to the reference diode without the buried p-layer, the RED diode has equal leakage, equal SOA capability under free-wheeling conditions, similar softness, 30% and 50% higher SOA for 51 and 91 mm diodes resp. with di/dt towards 10 kA/mus. Clamp-less operation is presented up to 1300 A with peak power above 15 MW at 125degC for the 91 mm diodes. For clamping diode application, this ruggedness can be further improved.
Keywords :
semiconductor diodes; semiconductor optical amplifiers; thyristors; current 1300 A; current 7 kA; integrated gate-commutated thyristor; radiation enhanced diffusion diode; semiconductor optical amplifier; size 51 mm; size 91 mm; temperature 125 degC; temperature 140 degC; voltage 4.5 kV; Annealing; Anodes; Doping profiles; Electrons; Helium; Leakage current; Semiconductor diodes; Semiconductor optical amplifiers; Temperature; Voltage;
Conference_Titel :
Power Semiconductor Devices & IC's, 2009. ISPSD 2009. 21st International Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-3525-8
Electronic_ISBN :
1943-653X
DOI :
10.1109/ISPSD.2009.5158022