• DocumentCode
    2429596
  • Title

    Research on the visual detection technology using eddy current microscope

  • Author

    Yu-Hua Cheng ; Yong Chen ; Chang-hua Zhang

  • Author_Institution
    Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China Chengdu, Chengdu
  • fYear
    2008
  • fDate
    7-11 June 2008
  • Firstpage
    307
  • Lastpage
    310
  • Abstract
    Visual eddy current testing technology is presented in this paper to test the invisible and buried subsurface flaws in metallic specimens. When coil is excited by intermittent impulse signal, the eddy current effect happens among the tested metal specimen which is near the coil, Because of magnetic-optic effect caused by eddy current magnetic field, the magnetic-optic film changes the polarization direction of the passing linear polarization beam. The beam, containing the defectspsila information can be accepted by CCD after being reflected through beamsplitter, and now the imperceptible flaws in subsurface of mental product can be visually tested. The image processing approaches are introduced in detail. Experimental tests have been done and the method presented is proved to be practicable by the experimental results.
  • Keywords
    CCD image sensors; eddy current testing; flaw detection; magneto-optical effects; optical beam splitters; optical information processing; optical microscopy; CCD; beamsplitter; eddy current magnetic field; eddy current microscope; flaw detection; image processing; intermittent impulse signal; magnetic-optic effect; metallic specimen; visual detection technology; visual eddy current testing technology; Charge coupled devices; Coils; Eddy current testing; Eddy currents; Image processing; Impulse testing; Magnetic films; Microscopy; Optical films; Polarization; Image processing; Linear polarized light; intermittent impulse signal; visual eddy current testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Networks and Signal Processing, 2008 International Conference on
  • Conference_Location
    Nanjing
  • Print_ISBN
    978-1-4244-2310-1
  • Electronic_ISBN
    978-1-4244-2311-8
  • Type

    conf

  • DOI
    10.1109/ICNNSP.2008.4590362
  • Filename
    4590362