DocumentCode :
2429713
Title :
Trends in low power digital system-on-chip designs
Author :
Saleh, R. ; Lim, G. ; Kadowaki, T. ; Uchiyama, K.
Author_Institution :
Univ. of British Columbia, Canada
fYear :
2002
fDate :
2002
Firstpage :
373
Lastpage :
378
Abstract :
A study of the future trends in low-power System-on-Chip (SoC) designs is presented, based on the recently announced ITRS-2001 technology characteristics for both high-performance and low-power devices from 2001 to 2016. We forecast the logic/memory composition of a reference low-power PDA design with an area constraint of 1 cm2 using both a bottom-up, power dissipation-constrained chip model and a top-down, design resource-constrained model. Together, these analyses indicate that without accelerated improvements in both chip design productivity and leakage power management, future SoC designs will be comprised of 80-90% memory, with the remaining logic blocks composed of special-purpose reusable IP cores, and a smaller fraction of the chip containing newly designed logic.
Keywords :
VLSI; application specific integrated circuits; digital integrated circuits; integrated circuit design; integrated circuit modelling; low-power electronics; ITRS-2001 technology characteristics; bottom-up chip model; design resource-constrained chip model; leakage power management; logic/memory composition; low power digital SoC designs; power dissipation model; power dissipation-constrained chip model; reference low-power PDA design; special-purpose reusable IP cores; system-on-chip designs; top-down chip model; Acceleration; Chip scale packaging; Design methodology; Logic design; Logic devices; Personal digital assistants; Power dissipation; Power systems; Productivity; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2002. Proceedings. International Symposium on
Print_ISBN :
0-7695-1561-4
Type :
conf
DOI :
10.1109/ISQED.2002.996775
Filename :
996775
Link To Document :
بازگشت