Title :
A novel modular smart PIC technology platform for functional diversification
Author :
Cai, Jun ; Szendrei, Larry ; Caron, David ; Park, Steven
Author_Institution :
Fairchild Semicond., South Portland, ME, USA
Abstract :
Toward great flexibility in making advanced analog interfaces, a novel modular smart PIC technology platform for functional diversification is proposed. This technology platform offers high voltage capability, high current level, very large variety of integrable components, and process modular flexibility thorough diversification or simplification according to the different product application needs. Masks can be added or subtracted based upon product design. A modular route creation system allows us to create the lowest cost process flow for the product needs. Applications of interest for the modular smart PIC technology we focus on ultra-portable, computing, consumer and communication.
Keywords :
power integrated circuits; advanced analog interfaces; modular smart power integrated circuit technology; CMOS logic circuits; CMOS process; CMOS technology; Energy management; Isolation technology; Logic design; Logic devices; Product design; Thermal management; Voltage;
Conference_Titel :
Power Semiconductor Devices & IC's, 2009. ISPSD 2009. 21st International Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-3525-8
Electronic_ISBN :
1943-653X
DOI :
10.1109/ISPSD.2009.5158035
