DocumentCode :
2430060
Title :
Post-breakdown conduction in sub-5 nm gate oxides in MOS devices
Author :
Miranda, E. ; Suné, J.
Author_Institution :
Fac. de Ingenieria, Buenos Aires Univ., Argentina
fYear :
2000
fDate :
2000
Abstract :
We investigate the electron transport through broken down ultrathin (<5 nm) SiO2 films in metal-oxide-semiconductor structures. We present experimental and theoretical results which demonstrate that the conduction properties of such systems are essentially governed by the cross-sectional area of the constriction connecting gate and substrate. It is shown that the hard or catastrophic breakdown mode exhibits conductance plateaus of the order of the quantum unit G0=2e2/h (≃12.9 kΩ-1), as found in quantum point contacts. On the other hand, the soft breakdown mode depends exponentially on the applied bias and can be understood in terms of tunneling through the potential barrier associated with the lower electron transversal state at the narrowmost part of the constriction
Keywords :
MIS devices; MOSFET; dielectric thin films; semiconductor device breakdown; tunnelling; 5 nm; MOS devices; SiO2; applied bias; catastrophic breakdown mode; conduction properties; cross-sectional area; electron transport; gate oxides; gate/substrate connecting constriction; hard breakdown mode; lower electron transversal state; metal-oxide-semiconductor structures; post-breakdown conduction; potential barrier; soft breakdown mode; tunneling; ultrathin SiO2 films; Breakdown voltage; Degradation; Electric breakdown; Electrons; Energy states; Joining processes; Laboratories; Leakage current; MOS devices; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Devices, Circuits and Systems, 2000. Proceedings of the 2000 Third IEEE International Caracas Conference on
Conference_Location :
Cancun
Print_ISBN :
0-7803-5766-3
Type :
conf
DOI :
10.1109/ICCDCS.2000.869838
Filename :
869838
Link To Document :
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