• DocumentCode
    2431073
  • Title

    Touch current analysis for power supplies designed for energy efficient regulations

  • Author

    Meng, William

  • Author_Institution
    Underwriters Labs. Taiwan Co., Ltd., Taipei, Taiwan
  • fYear
    2011
  • fDate
    10-12 Oct. 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Hundreds of thousands of SMPS (switching mode power supplies) are manufactured each year. Most of them are certified to either IEC 60950-1 or IEC 60065, and their derivatives. In most tests, operating conditions of the equipment under test (the term “EuT” will be used throughout this paper) such as environmental, input and output (loading) conditions are specified in these standards. However, loading condition of touch current measurement is not yet specified and hence different practices may arise among different test houses. During a set of experiments conducted couple months ago, it had been observed that loading conditions do influence touch current measurement, but unfortunately the manner and the extent are not predictable. Furthermore, we see more and more techniques spurred by energy efficiency standards are introduced into present SMPS, for instance, to reduce power consumption of stand-by mode by latching off some portion of circuits or changing operating frequencies. This paper intends to provide an overview of touch current measurement and summarize how touch current measurement is affected by loading conditions and modern design techniques.
  • Keywords
    IEC standards; electric current measurement; energy conservation; switched mode power supplies; IEC 60065; IEC 60950-1; SMPS; energy efficiency; energy efficient regulations; equipment under test; stand-by mode; switching mode power supplies; touch current analysis; touch current measurement; Current measurement; Electromagnetic interference; IEC standards; Loading; Noise; Switched-mode power supply; Energy Efficiency; Switching Mode Power Supplies; Touch Current;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Product Compliance Engineering (PSES), 2011 IEEE Symposium on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-61284-687-3
  • Type

    conf

  • DOI
    10.1109/PSES.2011.6088240
  • Filename
    6088240