DocumentCode :
2431769
Title :
Future of nano CMOS technology
Author :
Iwai, Hiroshi
Author_Institution :
Frontier Res. Center, Tokyo Inst. of Technol., Tokyo, Japan
fYear :
2011
fDate :
28-30 Sept. 2011
Abstract :
Summary form only given. Recently, CMOS downsizing has been accelerated very aggressively in both production and research levels, and even beautiful transistor operation of several nm gate length CMOS devices were reported in conferences. However, many serious problems are expected for implementing small-geometry MOSFETs into large scale integrated circuits. It is still questionable if we can successfully introduce deep sub-10 nm CMOS LSIs into market, because the problems expected at this moment - such as Ion/Ioff ratio, current drive, variation in the electrical characteristics, concerns for the yield, reliability and manufacturing cost. Considering the above situation, we have conducted nano-CMOS studies in advance to provide possible solutions to the future expected problems. The conclusion obtained by the study was that, in the nano-CMOS era, aggressive introduction of new materials, processes, structures, and operation concepts is required to solve the problems. Especially, the thinning of the gate oxide is the bottleneck of the future down-scaling, and thus, new materials and process technologies which enable decrease in the EOT (Equivalent Oxide Thickness) value less than 0.5 nm are very important. Also, changing the material of source/drain from semiconductor to metal is necessary to suppression of the diffusion of the dopant and thus, to secure the effective channel length less than several nm. Multigate structure such as Fin, Tri-gate, or nanowire is inevitable to suppress the short-channel effect. Unfortunately, there are no candidates among the so-called `beyond CMOS´ or `Post Si´ new devices, which are believed to really replace CMOS transistors usable for the products of highly integrated circuits within 20 years. Thus, our opinion is that we need to still continue CMOS based transistors with `More Moore´ approach with combining that of `More than Moore´. Good news is that Si Nanowire FETs have been found to have very promising characteristics wit- - h high Ion/Ioff ratio and high drive current. In this talk, future of nano-CMOS technology is presented.
Keywords :
CMOS integrated circuits; MOSFET; integrated circuit reliability; nanoelectronics; nanowires; CMOS LSI; CMOS transistors; Si nanowire FET; effective channel length; electrical characteristics; equivalent oxide thickness; gate length CMOS devices; integrated circuit reliability; more Moore approach; nanoCMOS technology; short-channel effect; small-geometry MOSFET; CMOS integrated circuits; Logic gates; Metals; Silicon; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
Conference_Location :
Kota Kinabalu
Print_ISBN :
978-1-61284-844-0
Type :
conf
DOI :
10.1109/RSM.2011.6088276
Filename :
6088276
Link To Document :
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