Title :
Influence of the gate thickness on the memory behavior of MFIS-FETs
Author :
Saif, Ala´eddin A. ; Jamal, Z.A.Z. ; Sauli, Z. ; Poopalan, P.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Kuala Perlis, Malaysia
Abstract :
The effect of the film thickness of the ferroelectric barium strontium titanate thin films at the memory behavior of ferroelectric-gate field effect transistor (FeFET) has been studied. The films have been fabricated as metal-ferroelectric-insulator-semiconductor (MFIS) configuration using sol-gel technique. In order to investigate the memory window behavior, the C-V measurements have been carried out for the prepared samples at different applied voltage values. The results show that the memory window width increases with the increase of the film thickness, which is attributed to the grain size effect. It is found also that the memory window increases as the applied voltage increases. The leakage current of the films has been presented to study the interface behavior of the gate junction; the result shows that the leakage current increases with increasing the film thickness. Furthermore, it is found that for all the tested samples the leakage current density is of order 10-8 A/cm2. These values of the current density are relatively low, leading to good interfaces situation.
Keywords :
MFIS structures; current density; ferroelectric thin films; field effect transistors; grain size; iron; leakage currents; sol-gel processing; thin film transistors; C-V measurements; Fe; MFIS configuration; MFIS-FET; ferroelectric-gate field effect transistor; film thickness; gate thickness; leakage current density; memory window behavior; metal-ferroelectric-insulator-semiconductor configuration; sol-gel technique; Capacitance-voltage characteristics; FETs; Films; Grain size; Leakage current; Semiconductor device measurement; Silicon;
Conference_Titel :
Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
Conference_Location :
Kota Kinabalu
Print_ISBN :
978-1-61284-844-0
DOI :
10.1109/RSM.2011.6088278