DocumentCode
2432738
Title
Segment based X-Filling for low power and high defect coverage
Author
Chen, Zhen ; Xiang, Dong ; Yin, Boxue
Author_Institution
Dept. of Com. Sci. & Tech., Tsinghua Univ., Beijing, China
fYear
2009
fDate
28-30 April 2009
Firstpage
319
Lastpage
322
Abstract
Many X-Filling strategies are proposed to reduce test power during scan based testing. Because their main motivation is to reduce the switching activities of test patterns in the test process, some of them are prone to reduce the test ability of test patterns, which may lead to low defect coverage. In this paper, we propose a segment based X-filling(SBF) technique to reduce test power using multiple scan chains, with minimal impact on defect coverage. Different from the previous filling methods, our X-filling technique is segment based and defect coverage aware. The method can be easily incorporated into traditional ATPG flow to keep capture power below a certain limit and keep the defect coverage at a high level.
Keywords
program testing; defect coverage; multiple scan chains; scan based testing; segment based X-filling; test patterns; test power; test process; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Costs; Filling; Flip-flops; Packaging; Power dissipation; Software testing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test, 2009. VLSI-DAT '09. International Symposium on
Conference_Location
Hsinchu
Print_ISBN
978-1-4244-2781-9
Electronic_ISBN
978-1-4244-2782-6
Type
conf
DOI
10.1109/VDAT.2009.5158159
Filename
5158159
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