• DocumentCode
    2432738
  • Title

    Segment based X-Filling for low power and high defect coverage

  • Author

    Chen, Zhen ; Xiang, Dong ; Yin, Boxue

  • Author_Institution
    Dept. of Com. Sci. & Tech., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    28-30 April 2009
  • Firstpage
    319
  • Lastpage
    322
  • Abstract
    Many X-Filling strategies are proposed to reduce test power during scan based testing. Because their main motivation is to reduce the switching activities of test patterns in the test process, some of them are prone to reduce the test ability of test patterns, which may lead to low defect coverage. In this paper, we propose a segment based X-filling(SBF) technique to reduce test power using multiple scan chains, with minimal impact on defect coverage. Different from the previous filling methods, our X-filling technique is segment based and defect coverage aware. The method can be easily incorporated into traditional ATPG flow to keep capture power below a certain limit and keep the defect coverage at a high level.
  • Keywords
    program testing; defect coverage; multiple scan chains; scan based testing; segment based X-filling; test patterns; test power; test process; Automatic test pattern generation; Circuit faults; Circuit testing; Clocks; Costs; Filling; Flip-flops; Packaging; Power dissipation; Software testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test, 2009. VLSI-DAT '09. International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    978-1-4244-2781-9
  • Electronic_ISBN
    978-1-4244-2782-6
  • Type

    conf

  • DOI
    10.1109/VDAT.2009.5158159
  • Filename
    5158159