DocumentCode
2432742
Title
Simulation and test of faults in WSI interconnect systems
Author
Gruetzner, M. ; Grabinski, H.
Author_Institution
Hannover Univ., West Germany
fYear
1989
fDate
3-5 Jan 1989
Firstpage
345
Lastpage
354
Abstract
Different fault mechanisms in interconnect systems are considered, and their fault behavior is discussed. To diagnose these faults by a digital test, special features of test pattern choice and design modifications are proposed. In contrast with existing tests for VLSI circuits, the specific dynamic behavior of large line systems in wafer-scale integration (WSI) must be taken into account. Analog simulations for opens, shorts, and delay faults were necessary. A special simulator called LISIM was used, since existing tools have proved to be of little value for simulating lossy line systems. From these results a fault diagnosis by a digital test turns out to be problematic, since a safe diagnosis of the considered faults is not guaranteed. In some cases this problem can be avoided by applying special test patterns. Additionally, design modifications are proposed, so that all these types of faults can be detected. The modifications do not affect the signal-to-noise ratio more than usual designs, and do not lend to an additional delay
Keywords
VLSI; automatic testing; digital simulation; fault location; integrated circuit testing; LISIM; WSI interconnect systems; design modifications; digital test; fault behavior; fault mechanisms; large line systems; signal-to-noise ratio; specific dynamic behavior; test pattern choice; Circuit faults; Circuit simulation; Circuit testing; Delay; Fault detection; Fault diagnosis; Integrated circuit interconnections; System testing; Very large scale integration; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9901-9
Type
conf
DOI
10.1109/WAFER.1989.47565
Filename
47565
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