• DocumentCode
    2432742
  • Title

    Simulation and test of faults in WSI interconnect systems

  • Author

    Gruetzner, M. ; Grabinski, H.

  • Author_Institution
    Hannover Univ., West Germany
  • fYear
    1989
  • fDate
    3-5 Jan 1989
  • Firstpage
    345
  • Lastpage
    354
  • Abstract
    Different fault mechanisms in interconnect systems are considered, and their fault behavior is discussed. To diagnose these faults by a digital test, special features of test pattern choice and design modifications are proposed. In contrast with existing tests for VLSI circuits, the specific dynamic behavior of large line systems in wafer-scale integration (WSI) must be taken into account. Analog simulations for opens, shorts, and delay faults were necessary. A special simulator called LISIM was used, since existing tools have proved to be of little value for simulating lossy line systems. From these results a fault diagnosis by a digital test turns out to be problematic, since a safe diagnosis of the considered faults is not guaranteed. In some cases this problem can be avoided by applying special test patterns. Additionally, design modifications are proposed, so that all these types of faults can be detected. The modifications do not affect the signal-to-noise ratio more than usual designs, and do not lend to an additional delay
  • Keywords
    VLSI; automatic testing; digital simulation; fault location; integrated circuit testing; LISIM; WSI interconnect systems; design modifications; digital test; fault behavior; fault mechanisms; large line systems; signal-to-noise ratio; specific dynamic behavior; test pattern choice; Circuit faults; Circuit simulation; Circuit testing; Delay; Fault detection; Fault diagnosis; Integrated circuit interconnections; System testing; Very large scale integration; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9901-9
  • Type

    conf

  • DOI
    10.1109/WAFER.1989.47565
  • Filename
    47565