DocumentCode
2432765
Title
Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS)
fYear
1994
fDate
16-19 Oct. 1994
Abstract
The following topics were dealt with: wafer level reliability and building in reliability; reliability modeling and simulation; mobile ion contamination; dielectric integrity testing; IC package reliability
Keywords
integrated circuit packaging; integrated circuit reliability; reliability theory; semiconductor device reliability; semiconductor process modelling; IC package reliability; built-in reliability; dielectric integrity testing; integrated reliability; mobile ion contamination; reliability modeling; reliability simulation; wafer level reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Conference_Location
Lake Tahoe, CA, USA
Print_ISBN
0-7803-1908-7
Type
conf
DOI
10.1109/IRWS.1994.515816
Filename
515816
Link To Document