DocumentCode
2432855
Title
Analysis of material properties for thin film membrane in thermal actuated micropump
Author
Hamid, Norihan Abdul ; Yunas, Jumril ; Majlis, Burhanuddin Yeop
Author_Institution
Inst. of Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia
fYear
2011
fDate
28-30 Sept. 2011
Firstpage
211
Lastpage
214
Abstract
This paper presents a comparison of thin film materials used as movable membrane for thermal actuated micropump. The materials discussed are PMMA, polyimide, silicon nitride (Si3N4) and single crystal silicon. The properties of membrane material are characterized using Finite Element Analysis (FEA) to study its mechanical and physical behavior that are suitable to be used as an actuator for thermal micropump. Parameters such as density, elastic modulus, stiffness, Poisson ratio, size, dimension and thickness are studied to find the optimum design for the membrane. From the analysis, it was shown that polyimide has the highest deflection that ranges from 0.13-0.86 μm at dimension area of less than 12 mm2. Polyimide is also the most promising candidate material for the pump membrane due to its elasticity, robustness, simple fabrication and its capability to handle very high temperatures.
Keywords
elastic moduli; finite element analysis; membranes; micropumps; thin films; PMMA; Poisson ratio; elastic modulus; finite element analysis; material properties; membrane material; movable membrane; polyimide; silicon nitride; single crystal silicon; stiffness; thermal actuated micropump; thermal micropump; thin film materials; thin film membrane; Biomembranes; Fabrication; Heating; Micropumps; Polyimides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
Conference_Location
Kota Kinabalu
Print_ISBN
978-1-61284-844-0
Type
conf
DOI
10.1109/RSM.2011.6088326
Filename
6088326
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