• DocumentCode
    2432917
  • Title

    Analog matching properties process dependency on MIM capacitors

  • Author

    Ping, Chu Tsui ; Ling, Tee Pei ; Lau, Günter

  • Author_Institution
    Technol. Dept., X-FAB Semicond. Foundries AG., Kuching, Malaysia
  • fYear
    2011
  • fDate
    28-30 Sept. 2011
  • Firstpage
    224
  • Lastpage
    227
  • Abstract
    A study on the effect of process fabrication for MIM capacitors analog matching performance was carried out, impacts from the MIM dielectrics, capacitor top and bottom metal materials, capacitor metal etch, wet cleaning, annealing process will be revealed by comparing the Pelgrom coefficients, i.e. the dependence of difference in capacitance of the matching pairs with respect to their corresponding square root of capacitor areas, the smaller the difference the better the matching. We have also investigated the related electrical properties, linearity as well as the reliability performance among the various process variants as assessed and reported in this evaluation study. The key area of matching dependency, and the process induced reliability concerns are identified. Optimization in process can be done to further improve the capacitors´ analog performance.
  • Keywords
    MIM devices; annealing; capacitors; dielectric materials; optimisation; semiconductor device reliability; MIM capacitors; MIM dielectrics; Pelgrom coefficients; analog matching property process; annealing process; bottom metal materials; capacitor metal etch; capacitor top; electrical properties; optimization; reliability performance; wet cleaning; Capacitors; Cleaning; Linearity; MIM capacitors; Metals; Reliability; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
  • Conference_Location
    Kota Kinabalu
  • Print_ISBN
    978-1-61284-844-0
  • Type

    conf

  • DOI
    10.1109/RSM.2011.6088329
  • Filename
    6088329