DocumentCode
2432917
Title
Analog matching properties process dependency on MIM capacitors
Author
Ping, Chu Tsui ; Ling, Tee Pei ; Lau, Günter
Author_Institution
Technol. Dept., X-FAB Semicond. Foundries AG., Kuching, Malaysia
fYear
2011
fDate
28-30 Sept. 2011
Firstpage
224
Lastpage
227
Abstract
A study on the effect of process fabrication for MIM capacitors analog matching performance was carried out, impacts from the MIM dielectrics, capacitor top and bottom metal materials, capacitor metal etch, wet cleaning, annealing process will be revealed by comparing the Pelgrom coefficients, i.e. the dependence of difference in capacitance of the matching pairs with respect to their corresponding square root of capacitor areas, the smaller the difference the better the matching. We have also investigated the related electrical properties, linearity as well as the reliability performance among the various process variants as assessed and reported in this evaluation study. The key area of matching dependency, and the process induced reliability concerns are identified. Optimization in process can be done to further improve the capacitors´ analog performance.
Keywords
MIM devices; annealing; capacitors; dielectric materials; optimisation; semiconductor device reliability; MIM capacitors; MIM dielectrics; Pelgrom coefficients; analog matching property process; annealing process; bottom metal materials; capacitor metal etch; capacitor top; electrical properties; optimization; reliability performance; wet cleaning; Capacitors; Cleaning; Linearity; MIM capacitors; Metals; Reliability; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
Conference_Location
Kota Kinabalu
Print_ISBN
978-1-61284-844-0
Type
conf
DOI
10.1109/RSM.2011.6088329
Filename
6088329
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