DocumentCode
2433397
Title
Optofluidic assembly of microdisk lasers on a silicon chip
Author
Ohta, Aaron T. ; Tien, Ming-Chun ; Yu, Kyoungsik ; Neale, Steven L. ; Wu, Ming C.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, CA
fYear
2008
fDate
21-23 July 2008
Firstpage
207
Lastpage
208
Abstract
A room-temperature optofluidic assembly process to integrate III-V microdisk lasers on a silicon chip is demonstrated. The assembly is accomplished using lateral-field optoelectronic tweezers, which achieves an unoptimized placement accuracy of approximately plusmn 0.25 mum.
Keywords
CMOS integrated circuits; III-V semiconductors; arsenic compounds; elemental semiconductors; gallium arsenide; gallium compounds; indium compounds; integrated optoelectronics; micro-optomechanical devices; microdisc lasers; microfluidics; radiation pressure; silicon; CMOS circuits; III-V microdisk lasers; InGaAs-InGaAsP; Si; lateral-field optoelectronic tweezers; optofluidic assembly process; silicon chip; temperature 293 K to 298 K; unoptimized placement accuracy; Assembly; Electrodes; Optical modulation; Optical pumping; Optical saturation; Pump lasers; Semiconductor lasers; Silicon; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
IEEE/LEOS Summer Topical Meetings, 2008 Digest of the
Conference_Location
Acapulco
ISSN
1099-4742
Print_ISBN
978-1-4244-1925-8
Electronic_ISBN
1099-4742
Type
conf
DOI
10.1109/LEOSST.2008.4590562
Filename
4590562
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