DocumentCode
2433510
Title
Heat flux sensor modeling
Author
Gridchin, Victor A. ; Lobach, Oleg V.
Author_Institution
Novosibirsk State Tech. Univ., Novosibirsk, Russia
fYear
2009
fDate
28-31 Oct. 2009
Firstpage
87
Lastpage
90
Abstract
In this paper the silicon micromachined heat flux sensor is present. A thermal resistance of the sensor is defined by simple model and finite element model. Temperature distribution inside heat flux sensor is received. Modeling results is compared with experimental data.
Keywords
elemental semiconductors; finite element analysis; micromechanical devices; semiconductor device models; silicon; temperature distribution; thermal resistance; thermal resistance measurement; thermopiles; Si; finite element model; heat flux sensor; micromachining; temperature distribution; thermal resistance; Biomembranes; Conductors; Mechanical sensors; Resistance heating; Sensor phenomena and characterization; Silicon; Temperature sensors; Thermal conductivity; Thermal resistance; Thermal sensors; Heat flux sensor; MEMS; micromachined technology; thermopile;
fLanguage
English
Publisher
ieee
Conference_Titel
Modern Problems of Nanoelectronics, Micro- and Nanosystem Technologies, 2009. INTERNANO 2009. International School and Seminar on
Conference_Location
Novosibirsk
Print_ISBN
978-1-4244-5534-8
Type
conf
DOI
10.1109/INTERNANO.2009.5335630
Filename
5335630
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