DocumentCode :
2433619
Title :
Microstructural studies on fire-through front contact metallization of Si solar cells
Author :
Sepeai, Suhaila ; Sulaiman, M.Y. ; Zaidi, Saleem H. ; Sopian, Kamaruzzaman
Author_Institution :
Solar Energy Res. Inst. (SERI), Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia
fYear :
2011
fDate :
28-30 Sept. 2011
Firstpage :
364
Lastpage :
367
Abstract :
Screen-printed Silver/Argentum (Ag) metallization is used in the photovoltaic industry for the front-side emitter contacts of crystalline silicon solar cells owing to its cost-effectiveness and high throughput. In order to obtain a better understanding for the formation of Ag paste and silicon (Si) interface, the firing treatment was studied. The microstructure properties of the fire-through Ag metal contacts formed on pyramid textured silicon wafers are investigated. The best firing temperature is 800°C with an open circuit voltage at 0.504V and efficiency of 13.67%. The Scanning Electron Microscopy (SEM) characterization of Ag shows that as the temperature further increased, the particles of Ag fuse together and the decrease of the Ag thin film thickness indicates that n+ layer has been formed.
Keywords :
metallisation; scanning electron microscopy; silicon; solar cells; SEM; Si; crystalline silicon solar cells; fire-through front contact metallization; firing treatment; front-side emitter; microstructural studies; photovoltaic industry; pyramid textured silicon wafers; scanning electron microscopy; screen-printed silver-argentum metallization; Fires; Firing; Grain size; Metallization; Photovoltaic cells; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro and Nanoelectronics (RSM), 2011 IEEE Regional Symposium on
Conference_Location :
Kota Kinabalu
Print_ISBN :
978-1-61284-844-0
Type :
conf
DOI :
10.1109/RSM.2011.6088361
Filename :
6088361
Link To Document :
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