DocumentCode
24338
Title
nMOS Short Channel Device Characteristics After Soft Oxide Breakdown and Implications for Reliability Projections and Circuits
Author
Nicollian, Paul E. ; Min Chen ; Yang Yang ; Chancellor, Cathy A. ; Reddy, Viswanath K.
Author_Institution
Texas Instrum., Dallas, TX, USA
Volume
61
Issue
1
fYear
2014
fDate
Jan. 2014
Firstpage
66
Lastpage
72
Abstract
The currents in all N-channel field effect transistor device terminals can be severely degraded when a soft breakdown event occurs from gate-to-drain. These effects become more pronounced for shorter channel lengths. We present a methodology for separating the effects of mobility degradation and threshold voltage shift on post breakdown device characteristics. Using an accurate equivalent circuit model, we analyze the impact of these parameter shifts on post breakdown circuit performance and the implications for post breakdown reliability projections and circuit design.
Keywords
MOSFET; equivalent circuits; semiconductor device breakdown; semiconductor device reliability; N-channel field effect transistor device terminals; circuit design; equivalent circuit; mobility degradation; nMOS short channel device characteristics; reliability projections; soft oxide breakdown; threshold voltage shift; Degradation; Delays; Electric breakdown; Integrated circuit modeling; Integrated circuit reliability; Logic gates; Breakdown; SiON; dielectric; oxide; reliability; time-dependent-dielectric-breakdown (TDDB);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2292551
Filename
6683066
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