• DocumentCode
    2434159
  • Title

    Improved thermal control for a-Si:H photovoltaic cells fabricated on polymeric substrates

  • Author

    Huang, J.R. ; Lee, Y. ; Toporow, C.M.C. ; Vendura, G.J., Jr. ; Jackson, T.N. ; Wronski, C.R.

  • Author_Institution
    Center for Thin Film Devices, Pennsylvania State Univ., University Park, PA, USA
  • fYear
    1997
  • fDate
    29 Sep-3 Oct 1997
  • Firstpage
    699
  • Lastpage
    702
  • Abstract
    The fabrication of a-Si:H photovoltaic (PV) cells on polyimide or other flexible polymeric substrates presents significant challenges compared to cells fabricated on metallized glass or metal substrates. In particular, the low thermal conductivity of polyimide materials, and the difficulty of maintaining flatness, make substrate thermal control problematic. The authors report here a cell fabrication process on a 2 mil thick polyimide substrate using a pressure-sensitive silicone adhesive to provide thermal contact and to control substrate warping. Results are directly compared with cells similarly fabricated but on conventional substrates
  • Keywords
    amorphous semiconductors; elemental semiconductors; hydrogen; polymers; semiconductor device manufacture; semiconductor device testing; semiconductor doping; silicon; solar cells; substrates; thermal analysis; thermal conductivity; 2 mm; Si:H; a-Si:H photovoltaic cells; polyimide materials; polymeric substrates; pressure-sensitive silicone adhesive; solar cell fabrication process; substrate warping; thermal conductivity; thermal contact; thermal control improvement; Conducting materials; Fabrication; Glass; Metallization; Photovoltaic cells; Photovoltaic systems; Polyimides; Polymers; Solar power generation; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1997., Conference Record of the Twenty-Sixth IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-3767-0
  • Type

    conf

  • DOI
    10.1109/PVSC.1997.654185
  • Filename
    654185