• DocumentCode
    2434179
  • Title

    3D printing method of multi piezo head using a photopolymer resin

  • Author

    Kim, Jung-Su ; Kim, Dong-Soo ; Lee, Min-Cheol

  • Author_Institution
    IT Machinery Res. Center, Daejeon
  • fYear
    2007
  • fDate
    17-20 Oct. 2007
  • Firstpage
    2587
  • Lastpage
    2590
  • Abstract
    Recently, study of 3D freeform fabrication method was working in the various applications. SFF (solid freeform fabrication) technologies are being developed for diverse processes. 3DP (three-dimensional printing), one of these SFF technologies, confers the advantage of high-speed processing at low cost, since it makes use of multi-nozzle inkjet printing. In this paper, we introduce a method of 3D freeform fabrication using a curing of photo-polymer resin and construct a system has multi printing head. A photo-polymer curing method has simply fabrication process and high strength of manufacturing part. We construct the printing system using multi piezo print head and it needs the heating system for lower the high viscosity of photo-polymer resin. In the result of experiment, printing system has not need the heating system because low viscosity photo-polymer resin is possible to jetting in the normal temperature. In the conclusion, we fabricate the 3D freeform part, which is suitable to the office environment using a photo-polymer curing method.
  • Keywords
    curing; nozzles; optical polymers; printing; resins; 3D freeform fabrication method; 3D printing method; heating system; jetting; multi printing head; multinozzle inkjet printing; multipiezo head; photo-polymer curing method; photopolymer resin; Costs; Curing; Fabrication; Heating; Manufacturing processes; Printing; Resins; Solids; Temperature; Viscosity; 3DP(Three Dimensional Printing); Photo-polymer resin; SFF(Solid Freeform Fabrication); UV curing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control, Automation and Systems, 2007. ICCAS '07. International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-89-950038-6-2
  • Electronic_ISBN
    978-89-950038-6-2
  • Type

    conf

  • DOI
    10.1109/ICCAS.2007.4406803
  • Filename
    4406803