Title :
The current distribution and heat localization in the integrated circuits plating at the effect of electromagnetic fields
Author :
Taran, Ye.P. ; Starostenko, V.V. ; Grygoriev, Ye.V. ; Lashennikov, D.E.
Author_Institution :
Tavrical Nat. Univ., Ukraine
Abstract :
The numerical researches on investigation of current distribution nature in plating are conducted at the effect of electromagnetic fields. The mechanisms leading to microscopic degradation of plating and edge effects origin are detected.
Keywords :
current distribution; electromagnetic fields; integrated circuit modelling; current distribution; edge effect; electromagnetic field; heat localization; integrated circuit plating; Current density; Current distribution; Degradation; Electromagnetic fields; Electromagnetic heating; IEEE catalog; Metallization; Microwave technology; Organizing; Threshold voltage;
Conference_Titel :
Microwave Conference, 2000. Microwave and Telecommunication Technology. 2000 10th International Crimean
Conference_Location :
Crimea, Ukraine
Print_ISBN :
966-572-048-1
DOI :
10.1109/CRMICO.2000.1256190
