DocumentCode
243470
Title
Dynamic Time Warping Based on Cubic Spline Interpolation for Time Series Data Mining
Author
Hailin Li ; Xiaoji Wan ; Ye Liang ; Shile Gao
Author_Institution
Coll. of Bus. Adm., Huaqiao Univ., Quanzhou, China
fYear
2014
fDate
14-14 Dec. 2014
Firstpage
19
Lastpage
26
Abstract
Dynamic time warping (DTW) and derivative dynamic time warping (DDTW) are two robust distance measures for time series, which allows similar shapes to match even if they are out of phase in the time axis. In this paper, we propose a novel dynamic time warping based on cubic spline interpolation (SIDTW) to improve the performance. The derivative of every point of time series is calculated by cubic spline interpolation and is used to replace the estimated derivatives in DDTW. After interpolation we use derivative-based sequences to represent the original time series, which is better to describe the trend of the original time series and more reasonable to warp. Meanwhile, we empirically point out that the quality of similarity measure for the three warping methods is nothing to do with the amount of warping. We experimentally perform the proposed method and compare with the existing ones, which demonstrates that in most cases our approach not only can produce much less singularities and obtain the best warping path with shorter length but also is an alternative version of DTW when time series datasets are not suitable for DTW to be measured.
Keywords
data mining; interpolation; splines (mathematics); time series; DDTW; DTW; SIDTW; cubic spline interpolation; derivative dynamic time warping; derivative-based sequences; dynamic time warping; time series data mining; Data mining; Interpolation; Market research; Shape; Splines (mathematics); Time measurement; Time series analysis; cubic spline interpolation; dynamic time warping; similarity measure; time series data mining;
fLanguage
English
Publisher
ieee
Conference_Titel
Data Mining Workshop (ICDMW), 2014 IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4799-4275-6
Type
conf
DOI
10.1109/ICDMW.2014.21
Filename
7022573
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