Title :
A three-dimensional measurement system based on moiré interferometry for visual inspection of hemi-sphere objects
Author_Institution :
Kohyoung Technol., Seoul
Abstract :
This paper focus on the measurement of hemi-sphere objects with specularity and shadow. For accurate measurement of these objects, a specially designed visual sensor system is proposed, which is based on phase shifting moire interferometry. To remove specular noise and shadow area efficiently, a compact multiple-pattern projection is implemented in the sensor system. To see how this system works, a series of experiments is performed and the results are analyzed in detail.
Keywords :
automatic optical inspection; image sensors; integrated circuit packaging; phase shifting interferometry; hemi-sphere objects; multiple-pattern projection; phase shifting moire interferometry; semiconductor packaging inspection; three-dimensional measurement system; visual inspection; visual sensor system; Flip chip; Gratings; Inspection; Light sources; Optical interferometry; Semiconductor device noise; Semiconductor device packaging; Sensor systems; Shape measurement; Wafer scale integration; Bump inspection; Hemi-sphere; Moire; Semiconductor packaging inspection; Solder ball inspection;
Conference_Titel :
Control, Automation and Systems, 2007. ICCAS '07. International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-89-950038-6-2
Electronic_ISBN :
978-89-950038-6-2
DOI :
10.1109/ICCAS.2007.4406837