• DocumentCode
    243533
  • Title

    Device Performance Analysis of Cloud Computing Data Center Two-Layer Interconnection Model Based on MPLS/IP Core Backbone Network

  • Author

    Hanmin Ye ; Zihang Song ; Qianting Sun

  • Author_Institution
    Guilin Univ. of Technol., Guilin, China
  • fYear
    2014
  • fDate
    14-14 Dec. 2014
  • Firstpage
    236
  • Lastpage
    242
  • Abstract
    By analyzing the difference of protocol construction angle and equipment processing angle between VPLS whose core is MPLS and VPLS two-layer networking model whose core network in IP network, this paper has proposed that PE equipment performance is easy to overload because VPLS two-layer networking model based on IP costs a large number of resource when constructing GRE or GREoIP sec. It has gathered and analyzed the core equipment performance under different architectures in GNS3 simulation environment. Comparing with the consumption situation of the present popular core equipment performance under different architectures, this paper has proposed the present optimal two-layer interconnection model which has combined VPLS, network virtualization technology and link aggregation technology.
  • Keywords
    IP networks; cloud computing; multiprotocol label switching; virtual private networks; GREoIP sec; MPLS-IP core backbone network; VPLS two-layer networking model; cloud computing data center; device performance analysis; equipment processing angle; link aggregation technology; network virtualization technology; protocol construction angle; two-layer interconnection model; Analytical models; Computer architecture; Data models; IP networks; Multiprotocol label switching; Network topology; Performance evaluation; cloud computing; data center; equipment performance analysis; network architecture; two-layer interconnection model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Data Mining Workshop (ICDMW), 2014 IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4799-4275-6
  • Type

    conf

  • DOI
    10.1109/ICDMW.2014.105
  • Filename
    7022603