• DocumentCode
    2435686
  • Title

    Insulation characteristics of indoor use 3.3 kV-33 kV epoxy resin insulators subjected to contamination and moisture

  • Author

    Miyamoto, Masayuki ; Takano, T. ; Matsuura, K.

  • Author_Institution
    Fuji Electr. Corp. Res. & Dev. Ltd., Chiba, Japan
  • fYear
    1988
  • fDate
    5-8 June 1988
  • Firstpage
    68
  • Lastpage
    71
  • Abstract
    An artificial contamination test was undertaken of the indoor 3.3 kV-33 kV epoxy post insulators to study the deterioration and flashover voltage (FOV). The following conclusions were reached: (1) the components of indoor contaminants are mainly ion chloride and ion sulfate. Deposits of these contaminants on insulators of indoor use panels over 2-3 years is less than 0.01 mg/cm/sup 2/; (2) indoor insulators are subject to moisture absorptionand dew condensation due to changes in temperature and humidity; (3) when the insulators are contaminated, FOV decreases considerably when an AC voltage is applied but is uneffected by electrode configuration; (4) FOV can be expressed as a function of surface leakage length (L) and equipment salt deposit density (ESDD), which are related to insulator design and panel contamination measurement, respectively.<>
  • Keywords
    environmental testing; insulators; 2 to 3 y; 3.3 to 33 kV; AC voltage; artificial contamination test; components of indoor contaminants; contamination; deterioration; dew condensation; epoxy post insulators; epoxy resin insulators; equipment salt deposit density; flashover voltage; indoor insulator; insulation characteristics; insulator design; moisture; moisture absorption; panel contamination measurement; surface leakage length; Contamination; Electrodes; Epoxy resins; Flashover; Humidity; Insulation; Insulator testing; Moisture; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1988., Conference Record of the 1988 IEEE International Symposium on
  • Conference_Location
    Cambridge, MA, USA
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1988.13868
  • Filename
    13868