• DocumentCode
    2435844
  • Title

    A TSV last integration approach with wafer level pre-patterned adhesive bonding

  • Author

    Zhu, Yunhui ; Ma, Shenglin ; Sun, Xin ; Cui, Qinghu ; Zhong, Xiao ; Bian, Yuan ; Chen, Jing ; Miao, Min ; Jin, Yufeng

  • Author_Institution
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, 100871, China
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a TSV last wafer level 3D integration scheme using pre-patterned benzocyclobutene (BCB) adhesive bonding was proposed. With pre-patterned BCB adhesive bonding, a one-time bottom-up TSV filling features as the last step, which eliminates the traditional solder bumping and underfill filling. Preliminary results show that this process is promising for integration of similar chips such as memory chips.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542115
  • Filename
    6542115
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2435844