DocumentCode :
2435952
Title :
Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions
Author :
Nagl, B. ; Czerny, B. ; Lederer, M. ; Khatibi, G. ; Thoben, M. ; Nicolics, J.
Author_Institution :
Siemens AG, Cumberlandstrasse 32-34, A-1140 Vienna, Austria
fYear :
2012
fDate :
17-20 Sept. 2012
Firstpage :
1
Lastpage :
6
Abstract :
This paper discusses different application relevant electrical loading cases of an IGBT module of a power inverter. Thereby, different operation conditions such as pulse frequencies, inverter output currents and output frequencies, as well as two different operation modes are discussed. Each load case investigation is conducted by electrical, thermal, and in situ vibration measurements. Moreover, on the base of finite element analyses a deeper insight is gained into reliability relevant thermo-mechanical behavior. For this purpose an IGBT module is operated at a load of 30% to 80% of its nominal value in order to cause representative thermo-mechanical displacements of dies and bond wires. By applying an inverter output frequency in a range of 1 to 280 Hz a temperature ripple of up to 40 K on the dies and a vertical displacement of up to 9 μm on a bond wire is observed. These results are important to improve life-time-predictions.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location :
Amsterdam, Netherlands
Print_ISBN :
978-1-4673-4645-0
Type :
conf
DOI :
10.1109/ESTC.2012.6542120
Filename :
6542120
Link To Document :
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