• DocumentCode
    2436007
  • Title

    Investigation of the palladium distribution in the intermetallic phase region of Au-Al wire bond interconnects

  • Author

    Marz, B. ; Graff, Andreas ; Klengel, Robert ; Petzold, M.

  • Author_Institution
    Center for Applied Microstructure Diagnostics (CAM), Walter-Hülse-Straße 1, 06120 Halle, Germany
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Palladium alloyed gold wire was used to form wire bond interconnects on aluminum metallization. By isothermal annealing of wire bond samples the formation of intermetallic Au-Al phases was stimulated. Compared to pure gold wire the IMP growth in the alloyed one is retarded. Comparative EBSD investigations of the phase regions exhibited slower growth rates. By STEM-EDS measurements compounds with higher Pd content could be revealed in the IMP.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542124
  • Filename
    6542124