DocumentCode
2436007
Title
Investigation of the palladium distribution in the intermetallic phase region of Au-Al wire bond interconnects
Author
Marz, B. ; Graff, Andreas ; Klengel, Robert ; Petzold, M.
Author_Institution
Center for Applied Microstructure Diagnostics (CAM), Walter-Hülse-Straße 1, 06120 Halle, Germany
fYear
2012
fDate
17-20 Sept. 2012
Firstpage
1
Lastpage
5
Abstract
Palladium alloyed gold wire was used to form wire bond interconnects on aluminum metallization. By isothermal annealing of wire bond samples the formation of intermetallic Au-Al phases was stimulated. Compared to pure gold wire the IMP growth in the alloyed one is retarded. Comparative EBSD investigations of the phase regions exhibited slower growth rates. By STEM-EDS measurements compounds with higher Pd content could be revealed in the IMP.
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location
Amsterdam, Netherlands
Print_ISBN
978-1-4673-4645-0
Type
conf
DOI
10.1109/ESTC.2012.6542124
Filename
6542124
Link To Document