TGV technology for Glass interposer

This study explored glass microfabrication technologies for TGV (Through Glass Via) formation can be applied interposer substrate of 3D packaging. Two TGV formation methods were studied and compared such as optical approach using Excimer laser and electrical approach using focused electrical discharging. Demonstration of laser microfabrication showed the result of 40um pitch of TGVs which is able to be fine pitch solution. And demonstration of focused electrical discharging method showed the result of ultrafast TGV process with 75um pitch. In this study, we compared characteristic of both technologies and pointed necessary future development for glass interposer application.