Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and post-annealing

Variations in the electrical resistivity and microstructural evolution in epoxy-based adhesives containing Ag micro-fillers (flakes and micro-particles) were investigated during curing and post-annealing. Sintering of micro-fillers was successfully induced in the matrix resins, although the sintering behavior varied depending on the matrix chemistry. The electrical resistivity of the adhesives was markedly reduced as a result of filler sintering. Thus, matrix chemistry is one of the important factors for design of electrically conductive adhesive materials.