• DocumentCode
    2436755
  • Title

    Low temperature joining technique (LTJT) as an alternative to lead-free soldering for die-attach applications

  • Author

    Jarosz, Mateusz ; Jakubowska, Malgorzata ; Kielbasinski, Konrad ; Mlozniak, Anna ; Teodorczyk, Marian

  • Author_Institution
    Institute of Electronic Materials Technology, Wolczynska 133, 01-919 Warsaw
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A group of silver, thick-film, screen printable and lead-free pastes varying in composition, with different grain size distribution of used Ag powders, has been elaborated and tested. They are designed to be sintered between 300 and 400°C. The technology of preparing these pastes is discussed. The application of the elaborated materials in die-attachment is demonstrated. Shear strengths ∼20 N/mm2 were achieved.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542164
  • Filename
    6542164
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2436755