DocumentCode
2437181
Title
Study of the impact of aging on many-core energy-efficient DSP systems
Author
Srivastav, Meeta ; Nazhandali, Leyla
Author_Institution
Bradley Dept. of Electr. & Comput. Eng., Virginia Tech, Blacksburg, VA, USA
fYear
2015
fDate
2-4 March 2015
Firstpage
66
Lastpage
70
Abstract
During the normal operational use, integrated circuits go through what is popularly known as wearout or aging. At system level, aging causes gradual speed degradation of the design over their service life. In a many-core homogeneous design and over a period of activity, this can lead to variation in speed depending on the workload distribution on cores. In the same design context, Voltage Scaling (VS) is another very widely used technique in gaining energy-efficiency. Process Variation (PV) also tend to have similar impact creating variation in speed and power among the cores. In this paper, we will first study the impact of aging and PV on above design system. Further, we will analyze their impact on energy efficient configurations under static and dynamic workload environment. Later, we will present our analysis over two different usage policies; using fastest core on the die as compared to uniform aging of all cores in the system. We conclude, that using fastest core in the system will yield higher performance benefits over its lifetime.
Keywords
VLSI; digital signal processing chips; integrated circuit design; multiprocessing systems; power aware computing; aging impact; gradual speed degradation; integrated circuits; many-core energy-efficient DSP systems; many-core homogeneous design; normal operational use; process variation; service life; ultra-low-power VLSI circuits; voltage scaling; workload distribution; Aging; Degradation; Digital signal processing; Human computer interaction; Reliability; Threshold voltage; Throughput; 45nm; Aging; DSP; DVFS; HCI; MOSRA; NBTI; PTM; low-power; many-core; process variation; voltage scaling;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2015 16th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-7580-8
Type
conf
DOI
10.1109/ISQED.2015.7085400
Filename
7085400
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