DocumentCode
2437612
Title
Inductively excited lock-in thermography for PCB-vias
Author
Bohm, Johannes ; Meier, Konrad ; Wolter, Klaus-Jurgen
Author_Institution
Technische Universitaet Dresden, Electronics Packaging Laboratory (IAVT), D-01062 Dresden, Germany
fYear
2012
fDate
17-20 Sept. 2012
Firstpage
1
Lastpage
6
Abstract
A novel non-destructive evaluation method of inductively excited lock-in thermography (called InduLIT in this paper) is investigated for crack detection on PCB-vias. Previous publications already showed the working principle. Now the crack inspection of PCB-vias using flat inductors is investigated in detail. FE-models were created to get a better understanding of the process and to find optimum excitation parameters. Planar coil prototypes were produced and InduLIT experiments were performed on test samples. A comparison of the FE-simulations and experiments showed a good correlation.
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location
Amsterdam, Netherlands
Print_ISBN
978-1-4673-4645-0
Type
conf
DOI
10.1109/ESTC.2012.6542205
Filename
6542205
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