DocumentCode :
2437704
Title :
Wafer Level Reliability Utilization and Trends
Author :
Achee, Ehren T.
fYear :
1994
fDate :
16-19 Oct 1994
Firstpage :
139
Keywords :
Condition monitoring; Data engineering; Decision making; Electronics industry; Failure analysis; Fuses; Packaging; Semiconductor device reliability; Semiconductor device testing; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Print_ISBN :
0-7803-1908-7
Type :
conf
DOI :
10.1109/IRWS.1994.515842
Filename :
515842
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2437704
