Evaluation of the predictive capability of Berkeley´s hot-carrier reliability model

A model for hot-carrier reliability prediction developed at the University of California is widely used in industry. Confusion exists, however, as to how the model is to be applied. The model´s devisers suggest that hot-carrier degradation is most rapid when substrate current is maximum, yet the model itself is in strong disagreement with this. Since the minimum lifetime for a given drain voltage is of most interest, the minimum prediction of the model needs to be evaluated. The necessity of using a novel hot-carrier stress method in the evaluation is demonstrated