Title :
Novel techniques for evaluation of interconnections in solar cells used for spacecraft power generation
Author :
Ferro, Robert J. ; Francis, Robert W. ; Frasco, Eric B. ; Pan, Robert B. ; Pierre-Louis, Enold ; Sve, Charles ; Berghaus, Martin
Author_Institution :
Aerosp. Corp., CA, USA
fDate :
29 Sep-3 Oct 1997
Abstract :
Solar cells used to power satellites are subject to diurnal temperature extremes more severe than those found on Earth. The resulting expansion and contraction can cause failure of interconnection welds because of differences among expansion coefficients. An experimental investigation of the reliability effects of thermal cycling on interconnections for one type of solar cell was conducted. The solar cells evaluated are single junction GaAs photovoltaic structures on germanium substrates. Welds are made between silver metallization on the solar cell and a silver plated molybdenum interconnect. Three experimental techniques were used for weld assessment: infrared imaging to identify locations where resistance to current causes Joule heating; cross sectioning of sample solar cells; and ultrasonic imaging. The experimental results are described, and conclusions of how the methods compare in accuracy and ease of use are given
Keywords :
III-V semiconductors; aerospace testing; elemental semiconductors; gallium arsenide; germanium; infrared imaging; inspection; semiconductor device metallisation; semiconductor device testing; solar cells; space vehicle power plants; ultrasonic imaging; welding; GaAs-Ge; GaAs-Ge solar cells; cross sectioning; expansion coefficients; infrared imaging; metallization; reliability effects; satellites; solar cell interconnections; space power; spacecraft power generation; thermal cycling; ultrasonic imaging; weld assessment methods; Earth; Gallium arsenide; Infrared heating; Photovoltaic cells; Photovoltaic systems; Satellites; Silver; Temperature; Thermal conductivity; Welding;
Conference_Titel :
Photovoltaic Specialists Conference, 1997., Conference Record of the Twenty-Sixth IEEE
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-3767-0
DOI :
10.1109/PVSC.1997.654246