Title :
An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics
Author :
Zhang, Guangfan ; Kwan, Chiman ; Xu, Roger ; Vichare, Nikhil ; Pecht, Michael
Author_Institution :
Intelligent Autom. Inc., Rockville
Abstract :
This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as "hard" failures. In the paper we show how it has been validated for intermittent and "hard" solder joint interconnect failures under temperature cycling loads.
Keywords :
failure analysis; interconnections; remaining life assessment; solders; baseline prediction algorithms; digital electronics; enhanced prognostic model; environmental loads; fusion techniques; intermittent failures; life consumption monitoring; prognostic algorithms; remaining useful life prediction; solder joint interconnect failures; temperature cycling loads; uncertainty adjusted prognostics; Aerospace electronics; Automation; Condition monitoring; Electrical resistance measurement; Load modeling; Prediction algorithms; Predictive models; Prognostics and health management; Soldering; Temperature measurement;
Conference_Titel :
Aerospace Conference, 2007 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
1-4244-0524-6
Electronic_ISBN :
1095-323X
DOI :
10.1109/AERO.2007.352884
