Title :
Transient thermal analysis of solid-state power devices — Making a dreaded process easy
Author_Institution :
Westinghouse Electric Corporation, Fusion Power Systems Department, Pittsburgh, Pa. 15236, USA
Abstract :
In spite of its importance in the rating and reliable application of power diodes and thyristors, the computation of instantaneous junction temperature has been a poorly understood and generally dreaded process among equipment designers. Under many practical circumstances, it has only been feasible by means of lengthy computer programs.
Keywords :
Impedance; Junctions; Silicon; Temperature measurement; Thermal analysis; Thermal conductivity; Transient analysis;
Conference_Titel :
Power Electronics Specialists Conference, 1975 IEEE
Conference_Location :
Culver City, California, USA
DOI :
10.1109/PESC.1975.7085587
