• DocumentCode
    2440806
  • Title

    Modeling on rapid ablation/sublimation from the surface of solid particles injected into thermal plasmas

  • Author

    Tanaka, Y. ; Mostaghimi, J.

  • Author_Institution
    Div. of Electr. Eng. & Comput. Sci., Kanazawa Univ., Kanazawa
  • fYear
    2008
  • fDate
    15-19 June 2008
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summay form only give. Thermal plasmas are often used in materials processing technologies, e.g., plasma spray, powder spheroidization, etc. The raw materials are normally injected into the plasma in the form of powders, which are then accelerated, heated, melted and evaporated. Evaporation/sublimation affects the interaction between the materials and thermal plasmas. Furthermore, evaporation/sublimation modifies the gas flow and temperature fields around the surface of the particles. To understand these complex phenomena, it is of great importance to model the interactions including phase transition, between solid, gas and plasmas in a self- consistent manner. In this work, we have developed a computational model to study the evaporation/ablation of graphite particles immersed in a thermal plasma. Carbon particle sublimation injected into thermal plasmas was simulated using the CIP-CUP method, which is a unified solver for incompressible and compressible flows including different phases of matter. In addition, the volume of fluid (VOF) function was adopted to track the boundary between solid and gas. The gas flow and temperature fields were obtained during the sublimation.
  • Keywords
    carbon; evaporation; graphite; plasma materials processing; spheroidizing; sublimation; carbon particle sublimation; evaporation; gas flow; graphite particles; plasma materials processing; plasma spray; plasma-material interaction; powder spheroidization; rapid ablation; rapid sublimation; solid particles; temperature field; thermal plasmas; volume of fluid function; Computational modeling; Fluid flow; Plasma accelerators; Plasma materials processing; Plasma simulation; Plasma temperature; Powders; Rapid thermal processing; Solid modeling; Thermal spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2008. ICOPS 2008. IEEE 35th International Conference on
  • Conference_Location
    Karlsruhe
  • ISSN
    0730-9244
  • Print_ISBN
    978-1-4244-1929-6
  • Electronic_ISBN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2008.4590971
  • Filename
    4590971