Title :
The effect of copper design rules on inductor performance
Author :
Detcheverry, C. ; van Noort, Wibo ; Hoofman, R. ; Tiemeijer, L. ; Nguyen, V.H. ; Verheyden, G. ; Bancken, P. ; Daamen, R. ; Havens, R.
Author_Institution :
Philips Res. Labs. Leuven, Belgium
Abstract :
In this paper, the effect of process-related design rules on inductor performance are shown. In advanced processes the copper line width is limited, and the metal pattern density must be as uniform as possible. The results obtained on inductors fabricated in-one metal layer with a different number of parallel tracks, with and without copper tiles are presented. The geometry and the orientation of the tiles are also varied. The comparison allows us to quantify the influence of copper tiles on the inductor quality factor.
Keywords :
Q-factor; S-parameters; chemical mechanical polishing; copper; inductors; integrated circuit metallisation; microwave integrated circuits; CMP process; Cu; S-parameters; copper line width; copper tiles; inductor performance; inductor quality factor; metal pattern density; on-chip inductors; process-related design rules; radio-frequency integrated circuits; symmetrical single loop inductors; Coils; Copper; Electric resistance; Impedance; Inductors; Process design; Q factor; Radiofrequency integrated circuits; Resonant frequency; Tiles;
Conference_Titel :
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location :
Estoril, Portugal
Print_ISBN :
0-7803-7999-3
DOI :
10.1109/ESSDERC.2003.1256822
