The effect of copper design rules on inductor performance

Author

Detcheverry, C. ; van Noort, Wibo ; Hoofman, R. ; Tiemeijer, L. ; Nguyen, V.H. ; Verheyden, G. ; Bancken, P. ; Daamen, R. ; Havens, R.

Author_Institution

Philips Res. Labs. Leuven, Belgium

fYear

2003

fDate

16-18 Sept. 2003

Firstpage

107

Lastpage

110

Abstract

In this paper, the effect of process-related design rules on inductor performance are shown. In advanced processes the copper line width is limited, and the metal pattern density must be as uniform as possible. The results obtained on inductors fabricated in-one metal layer with a different number of parallel tracks, with and without copper tiles are presented. The geometry and the orientation of the tiles are also varied. The comparison allows us to quantify the influence of copper tiles on the inductor quality factor.

Keywords

Q-factor; S-parameters; chemical mechanical polishing; copper; inductors; integrated circuit metallisation; microwave integrated circuits; CMP process; Cu; S-parameters; copper line width; copper tiles; inductor performance; inductor quality factor; metal pattern density; on-chip inductors; process-related design rules; radio-frequency integrated circuits; symmetrical single loop inductors; Coils; Copper; Electric resistance; Impedance; Inductors; Process design; Q factor; Radiofrequency integrated circuits; Resonant frequency; Tiles;

fLanguage

English

Publisher

ieee

Conference_Titel

European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on

Conference_Location

Estoril, Portugal

Print_ISBN

0-7803-7999-3

Type

conf

DOI

10.1109/ESSDERC.2003.1256822

Filename

1256822