DocumentCode
2441298
Title
Device and circuit considerations for high performance SOI technologies
Author
Bryant, A. ; Sleight, J. ; Assaderaghi, F. ; Shahidi, G.
Author_Institution
IBM Microelectron. Div., Essex Junction, VT, USA
fYear
2000
fDate
2000
Firstpage
29
Abstract
Summary form only given. The insatiable need for higher performance microprocessors has driven the development of high-speed deep-submicron Silicon On Insulator (SOI) CMOS technology. SOI 1.8 V microprocessors are currently produced in IBM´s manufacturing line at 220 nm groundrules, and microprocessors are being developed for 1.5 V-180 nm and 1.2 V-130 nm SOI technologies. These technologies are based on partially-depleted (PD) SOI CMOS transistor designs because fully-depleted SOI transistor designs require excessively thin SOI films for short-channel threshold voltage control and also need alternate workfunction gate materials to achieve required transistor thresholds. Inherent to PD-SOI CMOS transistors is a floating body that needs to be accounted for in transistor design, manufacturing, and circuit design
Keywords
CMOS digital integrated circuits; high-speed integrated circuits; low-power electronics; microprocessor chips; silicon-on-insulator; 1.8 V; 220 nm; floating body effect; high-speed deep-submicron SOI technology; microprocessor; partially-depleted CMOS transistor; CMOS process; CMOS technology; Circuit synthesis; Manufacturing; Microelectronics; Microprocessors; Silicon on insulator technology; Steady-state; Threshold voltage; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
0-9651577-4-1
Type
conf
DOI
10.1109/PPID.2000.870580
Filename
870580
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