Title :
Device and circuit considerations for high performance SOI technologies
Author :
Bryant, A. ; Sleight, J. ; Assaderaghi, F. ; Shahidi, G.
Author_Institution :
IBM Microelectron. Div., Essex Junction, VT, USA
Abstract :
Summary form only given. The insatiable need for higher performance microprocessors has driven the development of high-speed deep-submicron Silicon On Insulator (SOI) CMOS technology. SOI 1.8 V microprocessors are currently produced in IBM´s manufacturing line at 220 nm groundrules, and microprocessors are being developed for 1.5 V-180 nm and 1.2 V-130 nm SOI technologies. These technologies are based on partially-depleted (PD) SOI CMOS transistor designs because fully-depleted SOI transistor designs require excessively thin SOI films for short-channel threshold voltage control and also need alternate workfunction gate materials to achieve required transistor thresholds. Inherent to PD-SOI CMOS transistors is a floating body that needs to be accounted for in transistor design, manufacturing, and circuit design
Keywords :
CMOS digital integrated circuits; high-speed integrated circuits; low-power electronics; microprocessor chips; silicon-on-insulator; 1.8 V; 220 nm; floating body effect; high-speed deep-submicron SOI technology; microprocessor; partially-depleted CMOS transistor; CMOS process; CMOS technology; Circuit synthesis; Manufacturing; Microelectronics; Microprocessors; Silicon on insulator technology; Steady-state; Threshold voltage; Voltage control;
Conference_Titel :
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-9651577-4-1
DOI :
10.1109/PPID.2000.870580