Influence of the device package on the results of CDM tests-consequences for tester characterization and test procedure

Author

Brodbeck, Tilo ; Kagerer, Andreas

Author_Institution

Siemens AG, Munich, Germany

fYear

1998

fDate

6-8 Oct. 1998

Firstpage

320

Lastpage

327

Abstract

The results of CDM device level tests-opposite to SDM-are strongly influenced by the device packages. An investigation of different types of devices (technology and package) shows that the CDM withstand voltage depends on the peak current of the discharge current waveform and not on the charge which is stored on the device after charging. This information has important consequences for tester characterization and the test procedure. Furthermore, peak current investigation gives a chance to extrapolate CDM results from one specific package to other packages and even perhaps for SDM/CDM correlation.

Keywords

electric current; electrostatic discharge; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; test equipment; CDM device level tests; CDM result extrapolation; CDM tests; CDM withstand voltage; SDM/CDM correlation; device package effects; device packages; device technology; discharge current waveform; peak current; stored charge; test procedure; tester characterization; BiCMOS integrated circuits; Capacitance; Discrete event simulation; Electrostatic discharge; Pins; Semiconductor device packaging; Semiconductor device testing; Stress; Switches; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1998

Conference_Location

Reno, NV, USA

Print_ISBN

1-878303-91-0

Type

conf

DOI

10.1109/EOSESD.1998.737052

Filename

737052