Title :
Influence of the device package on the results of CDM tests-consequences for tester characterization and test procedure
Author :
Brodbeck, Tilo ; Kagerer, Andreas
Author_Institution :
Siemens AG, Munich, Germany
Abstract :
The results of CDM device level tests-opposite to SDM-are strongly influenced by the device packages. An investigation of different types of devices (technology and package) shows that the CDM withstand voltage depends on the peak current of the discharge current waveform and not on the charge which is stored on the device after charging. This information has important consequences for tester characterization and the test procedure. Furthermore, peak current investigation gives a chance to extrapolate CDM results from one specific package to other packages and even perhaps for SDM/CDM correlation.
Keywords :
electric current; electrostatic discharge; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; test equipment; CDM device level tests; CDM result extrapolation; CDM tests; CDM withstand voltage; SDM/CDM correlation; device package effects; device packages; device technology; discharge current waveform; peak current; stored charge; test procedure; tester characterization; BiCMOS integrated circuits; Capacitance; Discrete event simulation; Electrostatic discharge; Pins; Semiconductor device packaging; Semiconductor device testing; Stress; Switches; Voltage;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1998
Conference_Location :
Reno, NV, USA
Print_ISBN :
1-878303-91-0
DOI :
10.1109/EOSESD.1998.737052
