DocumentCode
2441879
Title
The impact of subprime mortgage crisis on the short-run and long-run volatility components of the Malaysian stock market
Author
Lai, Ng Sew ; Cheong, Chin Wen ; Yusof, Nurul Afidah Mohamad ; Ying, Khor Chia
Author_Institution
FOSEE, Multimedia Univ., Cyberjaya, Malaysia
fYear
2011
fDate
25-28 Sept. 2011
Firstpage
148
Lastpage
152
Abstract
This study investigates the long-run and short-run movements of two emerging stock market volatilities using a volatility decomposition methodology. We studied the impact of 2007-2008 subprime mortgage crisis on the transitory and permanent volatility components in terms of two empirical stylized facts, the leverage effect and volatility persistence. In order to do so, the long spanning data are separated into three different periods. For the former stylized fact, the crisis impact on the leverage effect is mainly temporary with no long-run effect to the stock markets. This finding explains that the leverage effect is mostly difficult to adjust in the short-run transitory volatility during the crisis periods. However with proper risk management and long term strategies, most of the market participants are able to anticipate and handle this news impact in the long-run. For the latter stylized fact, the crisis has slightly increased the volatility persistence in all the markets. From the viewpoint of heterogeneous market hypothesis, the higher intensity of volatility persistence implies the stock markets are less informational efficient.
Keywords
mortgage processing; risk management; stock markets; Malaysian stock market; heterogeneous market hypothesis; permanent volatility components; risk management; subprime mortgage crisis; transitory volatility components; volatility components; volatility decomposition methodology; Electric shock; Finance; Government; Indexes; Loans and mortgages; Stock markets; Strontium; component ARCH; econometrics; leverage effect; subprime mortgage crisis; volatility persistence;
fLanguage
English
Publisher
ieee
Conference_Titel
Business, Engineering and Industrial Applications (ISBEIA), 2011 IEEE Symposium on
Conference_Location
Langkawi
Print_ISBN
978-1-4577-1548-8
Type
conf
DOI
10.1109/ISBEIA.2011.6088792
Filename
6088792
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