DocumentCode :
2442202
Title :
Control of wafer charging during ion implantation: Issues, monitors and models
Author :
Current, Michael I. ; Lukaszek, Wes ; Vella, Michael C.
Author_Institution :
Silicon Genesis Corp., Campbell, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
137
Lastpage :
140
Abstract :
Charge control during ion implantation depends on the interaction of the ion beam plasma with the device wafer and other local sources of charged species. The key role of the net ion density, plasma electron temperature and plasma ion mass are discussed. The value of local monitoring of the current-voltage characteristics of the net plasma at the wafer surface with EEPROM sense and measurement devices is illustrated with effects of various charge control systems and the influence of resist patterning on the net current flow to the wafer. The special challenges of space charge control for sub-keV ion beams and the impact on local doping uniformity are also discussed
Keywords :
EPROM; electric sensing devices; ion implantation; plasma density; plasma materials processing; plasma temperature; semiconductor doping; EEPROM; charge control; current-voltage characteristics; ion implantation; local doping uniformity; measurement devices; net ion density; plasma electron temperature; plasma ion mass; resist patterning; sensing devices; space charge; sub-keV ion beams; wafer charging; Electrons; Ion beams; Ion implantation; Plasma density; Plasma devices; Plasma immersion ion implantation; Plasma measurements; Plasma properties; Plasma sources; Plasma temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-9651577-4-1
Type :
conf
DOI :
10.1109/PPID.2000.870642
Filename :
870642
Link To Document :
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