Title :
Quantifying a simple antenna design rule
Author :
Gabriel, Calvin T. ; De Muizon, Emmanuel
Author_Institution :
Philips Semicond., San Jose, CA, USA
Abstract :
Charging damage from plasma processing can be reduced through process architecture and plasma hardware and process optimization, but not all damage can be prevented. Antenna area ratio design rules are commonly used in the semiconductor industry to ensure that the remaining charging does not damage circuits. A procedure for defining and quantifying simple antenna design rules is shown in this paper. In a case study, poly and metal antenna area ratios of 300:1 are chosen as the design rule maximum. The limitations of these design rules are also discussed
Keywords :
CMOS integrated circuits; antennas in plasma; charge injection; plasma materials processing; antenna area ratio; antenna design rule; charging damage; plasma hardware; plasma processing; process architecture; process optimization; CMOS technology; Conductors; Electronics industry; Hardware; Integrated circuit interconnections; Plasma applications; Plasma materials processing; Process design; Routing; Testing;
Conference_Titel :
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-9651577-4-1
DOI :
10.1109/PPID.2000.870654
