Title :
Optimization of electrothermal material parameters using inverse modeling [polysilicon fuse interconnects]
Author :
Minixhofer, Rainer ; Holzer, Stefan ; Heitzinger, Clemens ; Fellner, Johannes ; Grasser, Tibor ; Selberherr, Siegfried
Author_Institution :
austriamicrosysterns AG, Unterpremstatten, Austria
Abstract :
A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed.
Keywords :
electric fuses; electric resistance; finite element analysis; interconnections; optimisation; semiconductor device metallisation; semiconductor device models; Si; electrothermal material parameter optimization; finite element simulations; fuse speed; inverse modeling; metallic interconnect materials; polysilicon fuse structures; reliability; resistance measurement; semiconductor fabrication; thermal coefficients; transient electrothermal 3D FEM analysis; Electric resistance; Electrical resistance measurement; Electrothermal effects; Fabrication; Finite element methods; Fuses; Inorganic materials; Inverse problems; Semiconductor materials; Time measurement;
Conference_Titel :
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location :
Estoril, Portugal
Print_ISBN :
0-7803-7999-3
DOI :
10.1109/ESSDERC.2003.1256889