Study of the influence of an electric field on the liquid-vapor interface during film boiling of stagnant fluids

Author

Verplaetsen, F. ; Berghmans, J.

Author_Institution

Dept. of Mech. Eng., Katholieke Univ., Leuven, Belgium

Volume

3

fYear

1996

fDate

6-10 Oct 1996

Firstpage

1755

Abstract

This paper describes the influence of an electric field on the liquid-vapor interface during film boiling from a horizontal surface of stagnant fluids (pool boiling). An iterative solution technique is used to calculate the equilibrium shape of the liquid-vapor interface during film boiling. In each iteration step, a fourth order Runge-Kutta integration technique is used to calculate the shape of the interface and a boundary element method to calculate the electric field. It is shown that an electric field elongates the vapor bubbles formed on this interface and that this effect has to be accounted for in the existing heat transfer models in order to describe the influence of an electric field on the heat transfer coefficient during film boiling

Keywords

Runge-Kutta methods; boundary-elements methods; bubbles; electric field effects; electrohydrodynamics; film boiling; heat transfer; iterative methods; stagnation flow; two-phase flow; boundary element method; electric field influence; film boiling; fourth order Runge-Kutta integration; heat transfer models; horizontal surface; interface shape; iterative solution technique; liquid-vapor interface; pool boiling; stagnant fluids; vapor bubbles elongation; Boundary element methods; Conductive films; Electrohydrodynamics; Frequency; Heat transfer; Mechanical engineering; Physics; Resistance heating; Shape; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE

Conference_Location

San Diego, CA

ISSN

0197-2618

Print_ISBN

0-7803-3544-9

Type

conf

DOI

10.1109/IAS.1996.559305

Filename

559305