DocumentCode
2443133
Title
Impact of charging on breakdown in deep trench isolation structures [parasitic MOSFET example]
Author
Elattari, B. ; Van den bosch, G. ; Schoenmaker, W. ; Groeseneken, Guido ; Coppens, P. ; Moens, P. ; De Pestel, F.
Author_Institution
IMEC, Leuven, Belgium
fYear
2003
fDate
16-18 Sept. 2003
Firstpage
513
Lastpage
516
Abstract
In this paper, the breakdown of a deep trench isolation structure has been analysed and modeled. In particular, it is shown that the breakdown voltage of the p-n junction in the silicon can be strongly affected by the presence of charges on the floating polysilicon within the trench. These charges might appear not only as process induced charges but also as a consequence of hot carrier injection during avalanche operation. The measured breakdown instabilities can be reproduced by TCAD simulations as well as by a simple theoretical model within which these results can be understood and predictions can be made.
Keywords
MOSFET; avalanche breakdown; hot carriers; isolation technology; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; technology CAD (electronics); TCAD; avalanche operation; breakdown charging impact; breakdown instabilities; deep trench isolation structures; floating gate; floating polysilicon charges; hot carrier injection; p-n junction breakdown voltage; parasitic MOSFET; process-induced charges; Ambient intelligence; Electric breakdown; Integrated circuit technology; Isolation technology; P-n junctions; Paper technology; Predictive models; Semiconductor device breakdown; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location
Estoril, Portugal
Print_ISBN
0-7803-7999-3
Type
conf
DOI
10.1109/ESSDERC.2003.1256926
Filename
1256926
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