• DocumentCode
    2443133
  • Title

    Impact of charging on breakdown in deep trench isolation structures [parasitic MOSFET example]

  • Author

    Elattari, B. ; Van den bosch, G. ; Schoenmaker, W. ; Groeseneken, Guido ; Coppens, P. ; Moens, P. ; De Pestel, F.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2003
  • fDate
    16-18 Sept. 2003
  • Firstpage
    513
  • Lastpage
    516
  • Abstract
    In this paper, the breakdown of a deep trench isolation structure has been analysed and modeled. In particular, it is shown that the breakdown voltage of the p-n junction in the silicon can be strongly affected by the presence of charges on the floating polysilicon within the trench. These charges might appear not only as process induced charges but also as a consequence of hot carrier injection during avalanche operation. The measured breakdown instabilities can be reproduced by TCAD simulations as well as by a simple theoretical model within which these results can be understood and predictions can be made.
  • Keywords
    MOSFET; avalanche breakdown; hot carriers; isolation technology; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; technology CAD (electronics); TCAD; avalanche operation; breakdown charging impact; breakdown instabilities; deep trench isolation structures; floating gate; floating polysilicon charges; hot carrier injection; p-n junction breakdown voltage; parasitic MOSFET; process-induced charges; Ambient intelligence; Electric breakdown; Integrated circuit technology; Isolation technology; P-n junctions; Paper technology; Predictive models; Semiconductor device breakdown; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
  • Conference_Location
    Estoril, Portugal
  • Print_ISBN
    0-7803-7999-3
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2003.1256926
  • Filename
    1256926