Title :
Monolithic Matching for Broadband Microwave Delay Lines
Author :
Moore, K.A. ; Sundelin, K.N. ; Lieberman, S.
Keywords :
Acoustic transducers; Aluminum; Appropriate technology; Circuit testing; Delay lines; Gold; Impedance; Packaging; Semiconductor device modeling; Ultrasonic transducers;
Conference_Titel :
1980 Ultrasonics Symposium
DOI :
10.1109/ULTSYM.1980.197516