Title :
MBIR reflectance spectrometry for deep trench structure with ANN and Levenberg-Marquardt combined algorithm
Author :
Zhang, Chuanwei ; Liu, Shiyuan ; Shi, Tielin
Author_Institution :
State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan
fDate :
Nov. 30 2008-Dec. 3 2008
Abstract :
Model-based infrared (MBIR) reflectance spectrometry has been introduced for characterization of the depth and profile of deep trench structures in dynamic random access memory (DRAM). Modeling the complex trench structure as a multilayer optical film stack with effective medium approximation (EMA) allows the determination of both trench depth and width from Fourier-transfer infrared (FTIR) reflectance spectrum. In this paper an algorithm combining artificial neural networks (ANN) and Levenberg-Marquardt (LM) is proposed to extract the geometric parameters from the measured reflectance data. An initial estimate of the geometric parameters is obtained by the ANN, and then it is used as an input for the LM algorithm which converges to a final solution with a few iterations. The combined algorithm has been implemented on our own experimental platform, and it has been demonstrated to achieve very high accurate results as well as fast enough computation ability.
Keywords :
DRAM chips; infrared spectroscopy; inverse problems; reflectivity; ANN; Fourier-transfer infrared reflectance spectrum; Levenberg-Marquardt combined algorithm; MBIR reflectance spectrometry; deep trench structure; dynamic random access memory; effective medium approximation; model-based infrared reflectance spectrometry; multilayer optical film stack; Artificial neural networks; Infrared spectra; Metrology; Optical films; Optical refraction; Optical sensors; Random access memory; Reflectivity; Solid modeling; Spectroscopy; Levenberg-Marquardt; artificial neural networks; deep trench; model-based infrared reflectance spectrometry;
Conference_Titel :
Sensing Technology, 2008. ICST 2008. 3rd International Conference on
Conference_Location :
Tainan
Print_ISBN :
978-1-4244-2176-3
Electronic_ISBN :
978-1-4244-2177-0
DOI :
10.1109/ICSENST.2008.4757104