Abstract :
CMP aims at providing universities, research laboratories and industries with the possibility of having their integrated circuit projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8 μm, DLM/TLM 0.6 μm, DLP/4LM 0.35 μm, SLP/6LM 0.25 μm, SLP/6LM 0.18 μm, BiCMOS DLP/DLM 0.8 μm, SiGe HBT 0.8 μm DLP/DLM, SiGe HBT 0.35 μm SLP/5LM and GaAs HEMT 0.2 μm. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8 μm and 0.6 μm, BiCMOS DLP/DLM 0.8 μm and HEMT GaAs 0.2 μm, using compatible front-side bulk micro-machining. MUMPS is offered as a surface micro-machining process, allowing one to integrate MEMS only microstructures. Finally, the main processes for Multi-Chip Modules (MCMs) are also available through CMP.
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; HEMT integrated circuits; bipolar integrated circuits; integrated circuit manufacture; micromachining; micromechanical devices; multichip modules; 0.18 to 0.8 micron; BiCMOS technology; CMOS technology; CMP; GaAs; GaAs HEMT technology; IC prototyping; MCM fabrication; MEMS; MUMPS process; Si; SiGe; SiGe HBT technology; deep submicron processes; front-side bulk micromachining; low cost manufacturing; low volume IC production; micro electro mechanical systems; microstructures; multi-chip modules; submicron processes; BiCMOS integrated circuits; Costs; Educational institutions; Gallium arsenide; Germanium silicon alloys; HEMTs; Heterojunction bipolar transistors; Manufacturing; Micromechanical devices; Silicon germanium;
